Get current pricing for Wyko, BP2000W Bump Measurement Profiling System. Right Inspection Tool For Flip-chip Process Control. Repeatably Measures Solder Bump Heights, From 150 Micro-me . Product Category: Semiconductor, Sub Category::

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Manufacturer: Wyko Part number: BP2000W Description: Bump Measurement Profiling System. Right Inspection Tool For Flip-chip Process Control. Repeatably Measures Solder Bump Heights, From 150 Micro-me . Product Category: Semiconductor, Sub Category:

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Manufacturer: Wyko Part number: BP2000W Description: Bump Measurement Profiling System. Right Inspection Tool For Flip-chip Process Control. Repeatably Measures Solder Bump Heights, From 150 Micro-me . Product Category: Semiconductor, Sub Category: